首页
Etchback
精华吧
→
答案
→
知识竞赛未分类
Etchback
A、强浸蚀
B、弱浸蚀
C、凹蚀
正确答案:C
Tag:
英语单词知识竞赛
时间:2024-07-12 20:51:12
上一篇:
small outline l-leaded package(SOI)
下一篇:
Activating
相关答案
1.
press platen
2.
small outline integrated circuit(SOIC)
3.
tape automated bonding(TAB)
4.
thick film thermistor
5.
stray current
6.
Quality control level
7.
mealing
8.
vesication
9.
thermal shock test
10.
Comparative Tracking Index
热门答案
1.
chalcogenide semiconductor
2.
adhesion strength
3.
component
4.
flux activity
5.
bonding layer
6.
effluent
7.
polyester woven glass fabric copper - clad laminates
8.
anti reflection film
9.
bridging
10.
metal quad flat package(MQFP)